Embedded systems and printed circuit boards as weak spots in HV-H3TRB tests-Reference-Cited by-同舟云学术

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Embedded systems and printed circuit boards as weak spots in HV-H3TRB tests

Published:2022-11 Issue: Volume:138 Page:114687
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Brunko A.,Meier M.R.,Gloth M.,Kaminski N.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Fast power cycling test of IGBT modules in traction application;Held,1997

2. Acceleration of temperature humidity bias (THB) testing on IGBT modules by high bias levels;Zorn,2015

3. Improved HV-H3TRB robustness of a 1700 V IGBT chip set in standard power modules;Peters,2021

4. Challenges in humidity tests on GaN-devices;Brunko,2020

5. Comprehensive model for humidity testing correlation;Peck,1986

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Iodine vapour based quality test for coating and potting materials of (power) electronic devices;Microelectronics Reliability;2023-11

2. A Future Outlook of Power Devices From the Viewpoint of Power Electronics Trends;IEEE Transactions on Electron Devices;2023

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