Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA-Reference-Cited by-同舟云学术

Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA

Published:2011-08 Issue:8 Volume:51 Page:1372-1376
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Wang Tong Hong,Paisner Sara N.,Lee Chang-Chi,Chen Susan,Lai Yi-Shao

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Kevin Weed, Allan Kirkpatrick. An experimental investigation of the emissivity of various electronic packages. In: Twelfth IEEE SEMI-THERM symposium; 1996. p. 59–64.

2. The Advanced Semiconductor Engineering Group. ASE package handbook; 2005. p. 121.

3. Arun Gowda, David Esler, Sandeep Tonapi. Voids in thermal interface material layers and their effect on thermal performance. In: Seventh electronics packaging technology conference, Singapore; 2004. p. 41–46.

4. Robert C. Campbell, Stephen E. Smith, Raymond L. Dietz. Measurement of adhesive bondline effective thermal conductivity and thermal resistance using the laser flash method. In: Fifteenth IEEE SEMI-THERM Symposium, San Diego, CA; 1999. p. 83–97.

5. Flash diffusivity method: a survey of capabilities;Campbell;Electron Cooling,2002

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Detailed Thermal Resistance Network Analysis of FCBGA Package;Journal of Thermal Science;2023-10-28

2. Performance of Isotropic and Anisotropic Heat Spreaders;Journal of Electronic Materials;2012-06-28