Author:
Jang Kyung-Woon,Park Jin-Hyoung,Lee Soon-Bok,Paik Kyung-Wook
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. An overview of advances in conductive adhesive joining technology for electronics applications;Liu;Mater Technol,1995
2. Flip chip assembly on organic boards using anisotropic conductive adhesives/films and nickel/gold bump;Yim;Adv Electron Pack,1999
3. Feil M, Adler C, Hemmetzberger D, Konig M, Bock K. The challenge of ultra thin chip assembly. In: Proc 54th electron comp technol conf; 2004. p. 35–40.
4. Anisotropic conductive film flip chip joining using thin chips;Jokinen;Microelectron Reliab,2002
5. Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation;Kwon;J Elect Pack,2005
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