Interfacial microstructure of diffusion-bonded SiC and Re with Ti interlayer

Author:

Kim Joo-HyungORCID,Kim Dong Seok,Lim Seong Taek,Kim Do Kyung

Funder

Defense Acquisition Program Administration and Agency for Defense Development

R&D Convergence Program of MSIP (Ministry of Science, ICT and Future Planning) and NST (National Research Council of Science &Technology) of Republic of Korea

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference17 articles.

1. Cvd tungsten and tungsten-rhenium alloys for structural applications .3. Recent developemnts;Huegel;J. Electrochem Soc.,1970

2. Structure of rhenium coatings obtained by CVD;Gelfond;J. Struct. Chem,2009

3. A study of CVD growth kinetics and morphological evolution of rhenium from ReCl5;Yang;Surf. Coat. Tech.,2015

4. Solid-state diffusion bonding of Tungsten-25 rhenium alloy;Nieh;J. Mater Sci.,1986

5. Metal to ceramic joining via a metallic interlayer bonding technique;Jadoon;J. Mater Process Tech.,2004

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