Precipitation induced by diffusivity anisotropy in Sn grains under electron current stressing
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference11 articles.
1. Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
2. Extreme Fast-Diffusion System: Nickel in Single-Crystal Tin
3. Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints
4. Effect of Sn Grain Orientation on the Cu6Sn5 Formation in a Sn-Based Solder Under Current Stressing
5. Electromigration failure in flip chip solder joints due to rapid dissolution of copper
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3. Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints;Materials;2022-07-21
4. Electromigration and Thermomechanical Fatigue Behavior of Sn0.3Ag0.7Cu Solder Joints;Journal of Electronic Materials;2017-12-06
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