Interfacial heat transfer and microstructural analyses of a Bi- 5% Sb lead-free alloy solidified against Cu, Ni and low-C steel substrates-Reference-Cited by-同舟云学术

Interfacial heat transfer and microstructural analyses of a Bi- 5% Sb lead-free alloy solidified against Cu, Ni and low-C steel substrates

Published:2021-04 Issue: Volume:860 Page:158553
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Soares Thiago,Cruz Clarissa,Xavier Marcella,Reyes Rodrigo V.,Bertelli Felipe^ORCID,Garcia Amauri,Spinelli José E.,Cheung Noé

Funder

Fundação de Amparo à Pesquisa do Estado do Amazonas

Conselho Nacional de Desenvolvimento Científico e Tecnológico

Fundação de Amparo à Pesquisa do Estado de São Paulo

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

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