High thermal conductivity and mechanical properties of Si@Graphite/Aluminum nitride/aluminum composites for high-efficiency thermal management

Author:

Fan Rui,Huang Ying,Han Xiaopeng,Peng Xuanyi

Funder

Northwestern Polytechnical University

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference59 articles.

1. Improving the vertical thermal conductivity of carbon fiber-reinforced epoxy composites by forming layer-by-layer contact of inorganic crystals;Lee;Materials,2019

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3. Foam composite used to e.g. transfer or store thermal energy, comprises thermally conductive foam including pores disposed within the thermally conductive foam and a filler disposed in the pores of the thermally conductive foam;Tang,2018

4. Numerical simulation of heat sink cooling in the mainboard chip of a computer with temperature dependent thermal conductivity;Zaretabar;Appl. Therm. Eng.,2018

5. Gradient silicon-aluminum-silicon carbide aluminum electronic encapsulated composite material comprises e. layered structure, composed of silicon aluminum layer, silicon carbide-silicon aluminum layer, and silicon carbide aluminum layer;Zhou;Harbin Cast-Triped-Hit New Materials,2019

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