The effect of non-reactive alloying elements on the growth kinetics of the intermetallic compound between liquid Sn-based eutectic solders and Ni substrates-Reference-Cited by-同舟云学术

The effect of non-reactive alloying elements on the growth kinetics of the intermetallic compound between liquid Sn-based eutectic solders and Ni substrates

Published:2007-08 Issue:1-2 Volume:440 Page:333-340
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Lin Chung-Yung,Jao Chien-Chung,Lee Chiapyng,Yen Yee-Wen

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference24 articles.

1. Lead (Pb)-free solders for electronic packaging

2. Reactive wetting between molten Sn-Bi and Ni substrate

3. Morphological transition of interfacial Ni3Sn4 grains at the Sn-3.5Ag/Ni joint

4. Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils

5. Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders

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