Effect of structure transformation on the creep characteristics of Sn–3wt% Bi alloy
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference25 articles.
1. Microstructural evolution in the Sn-Cu-Ni and Pb-Sn solder joints with Cu and Pt-Ag metallized Al2O3 substrate
2. Interfacial reactions and growth kinetics for intermetallic compound layer between In–48Sn solder and bare Cu substrate
3. Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging
4. The formation of nano-Ag3Sn particles on the intermetallic compounds during wetting reaction
5. Activation energies of intermetallic compound growth at interface between Sn–5Bi–3.5Ag solder and Cu substrate
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of Graphitic Carbon Nitride Nanosheets Addition on the Microstructure and Mechanical Properties of Sn-3.5Ag-0.5Cu Solder Alloy;Journal of Electronic Materials;2018-06-29
2. Effects of Cu, Zn on the Wettability and Shear Mechanical Properties of Sn-Bi-Based Lead-Free Solders;Journal of Electronic Materials;2014-11-01
3. Effect of aging treatment on microstructure and creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys;Materials Science and Technology;2013-12-06
4. Effect of grain size on the primary and secondary creep behavior of Sn–3 wt.% Bi alloy;Journal of Materials Science;2007-12-12
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