Robust ultra-thin RuMo alloy film as a seedless Cu diffusion barrier
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference31 articles.
1. Analysis of the effects of scaling on interconnect delay in ULSI circuits
2. Ultrathin Diffusion Barriers/Liners for Gigascale Copper Metallization
3. Formation of copper silicides from Cu(100)/Si(100) and Cu(111)/Si(111) structures
4. Diffusion barrier property of TaN between Si and Cu
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