Effects of reflow and cooling conditions on interfacial reaction and IMC morphology of Sn–Cu/Ni solder joint
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference11 articles.
1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2. Lead-free Solders in Microelectronics
3. Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders
4. Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder
5. Elimination of Au-embrittlement in solder joints on Au/Ni metallization
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1. Microstructure evolution and shear behavior of Pb–16Sn–7.5Sb–xAg/Cu joints;Journal of Materials Science;2024-06-27
2. Effect of Nano-Cu6Sn5 upon development mechanism of Cu–Ni–Sn compounds and mechanical characteristics for mixed solder joints;Materials Characterization;2024-01
3. Cu-Ni-Sn Ternary Phase Diagram Evaluation;MSI Eureka;2022-04-27
4. Reliability Analysis on the Flexible Printed Circuit Board After Reflow Soldering;Recent Progress in Lead-Free Solder Technology;2022
5. Investigation on the Mechanical Behavior Evolution Occurring in Lead Free Solder Joints Exposed to Thermal Cycling;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06
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