Effect of γ-Fe2O3 nanoparticles size on the properties of Sn-1.0Ag–0.5Cu nano-composite solders and joints
Author:
Funder
National Science and Technology Major Project
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference40 articles.
1. Effect of graphene nanosheets reinforcement on the performance of Sn-Ag-Cu lead-free solder;Liu;Mater. Sci. Eng. A,2013
2. Effects of Ga addition on microstructure and properties of Sn-0.5 Ag-0.7 Cu solder;Luo;J. Mater. Sci. Mater. Electron.,2014
3. Improvement of thermal fatigue properties of Sn-Ag-Cu lead-free solder interconnects on casio's wafer-level packages based on morphology and grain boundary character;Terashima;J. Electron. Mater.,2009
4. Advances in lead-free electronics soldering;Suganuma;Curr. Opin. Solid State Mater. Sci.,2001
5. Novel Fe-containing Sn-1Ag-0.5 Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products;Shnawah;Microelectron. Reliab.,2012
Cited by 49 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Nanoparticle-reinforced solder alloys: A comprehensive review of recent formulation properties, and mechanical performance;Journal of Materials Research and Technology;2024-09
2. Thermal, microstructural, wettability and mechanical properties of Sn1.0Ag0.5Cu composite solder modified with Ti nanoparticles;Materials Characterization;2024-06
3. Effect of Cetyl Trimethyl ammonium bromide (CTAB) amount on the Nanoindentation creep behaviour of Sn-cu-Y2O3 nanocomposite Lead-free solder;Materials Characterization;2024-06
4. Interfacial reaction of Cu/SAC105/Cu solder joints reinforced with Ti nanoparticles under vacuum thermo-compression bonding;Journal of Materials Research and Technology;2024-03
5. Cobalt-Graphene NanoSheets enhanced Sn–0.3Ag–0.7Cu composite solder: Study on microstructure, crystal orientation relations and mechanical properties;Materials Science and Engineering: A;2024-03
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3