Significantly retarded interfacial reaction between an electroless Ni–W–P metallization and lead-free Sn–3.5Ag solder-Reference-Cited by-同舟云学术

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Significantly retarded interfacial reaction between an electroless Ni–W–P metallization and lead-free Sn–3.5Ag solder

Published:2013-07 Issue: Volume:565 Page:11-16
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Yang Ying,Balaraju J.N.,Chong Ser Choong,Xu Hui,Liu Changqing,Silberschmidt Vadim V.,Chen Zhong

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference29 articles.

1. Activation energies of intermetallic growth of Sn-Ag eutectic solder on copper substrates

2. Effects of reflow on wettability, microstructure and mechanical properties in lead-free solders

3. Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate

4. Influence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints

Cited by 27 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The feasibility study of replacing the traditional amorphous Ni-P with an amorphous Ni-Cu-P layer;Journal of Materials Science: Materials in Electronics;2024-04

2. Comparison of interfacial reactions and isothermal aging of cone Ni-P and flat Ni-P with Sn3.5Ag solders;Applied Surface Science;2023-07

3. Deposition behavior of electroless Ni‐W‐P coating on Zr‐4 surface;Vietnam Journal of Chemistry;2023-06-21

4. Interface Reaction between Tin Solder and Nanocrystalline Ni and Ni-Mo Coatings Obtained by Electrodeposition;Journal of Materials Engineering and Performance;2022-04-11

5. Effects of the surface roughness on wetting properties and interfacial reactions between SAC305 solder and Cu substrate with Ni–W–P coating;Journal of Materials Science: Materials in Electronics;2020-07-28

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