Brass bonding using copper nanoparticles and zinc powder for packaging of power electronic devices
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference39 articles.
1. High-temperature electronics - a role for wide bandgap semiconductors?;Neudeck;Proc. IEEE,2002
2. Silicon carbide: a unique platform for metal-oxide-semiconductor physics;Liu;Appl. Phys. Rev.,2015
3. Material science and device physics in SiC technology for high-voltage power devices;Kimoto;Jpn. J. Appl. Phys.,2015
4. A review on die attach materials for SiC-based high-temperature power devices;Chin;Metall. Mater. Trans. B,2010
5. Low-temperature sintering of nanoscale silver paste for attaching large-area chips;Lei;Compon. Packag. Technol. IEEE Trans.,2010
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