Microstructure evolution and fatigue crack growth of diffusion bonded Ti-6Al-4V titanium alloy
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference38 articles.
1. Interfacial energy as the driving force for diffusion bonding of ceramics;Kovacevic;Acta Mater.,2020
2. Electrically assisted superplastic forming/diffusion bonding of the Ti2AlNb alloy sheet;Li;Int. J. Adv. Manuf. Technol.,2020
3. A new technology for diffusion bonding intermetallic TiAl to steel with composite barrier layers;He;Mater. Charact.,2003
4. Anisotropic porous Ti6Al4V alloys fabricated by diffusion bonding: Adaption of compressive behavior to cortical bone implant applications;Li;J. Mater. Sci. Technol.,2016
5. The structural design and superplastic forming/diffusion bonding of Ti2AlNb based alloy for four-layer structure;Du;Mater. Des.,2016
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