A new temperature stable microwave dielectric with low-firing temperature in Bi2MoO6–TiO2 system
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference28 articles.
1. Ceramic and Glass-Ceramic Packaging in the 1990s
2. Low loss dielectric materials for LTCC applications: a review
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4. Mixture Behavior and Microwave Dielectric Properties in the Low-fired TiO2–CuO System
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