Ab initio comparative study of the Cu–In and Cu–Sn intermetallic phases in Cu–In

Ab initio comparative study of the Cu–In and Cu–Sn intermetallic phases in Cu–In–Sn alloys

Published:2012-11 Issue: Volume:542 Page:280-292
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Ramos de Debiaggi S.,Deluque Toro C.,Cabeza G.F.,Fernández Guillermet A.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference57 articles.

1. S.A. Sommadossi, Investigation on Diffusion Soldering in Cu/In/Cu and Cu/In48Sn/Cu Systems, Dissertation an der Universität Stuttgart, Bericht Nr. 125, 2002.

2. Interface reaction systematics in the Cu/In–48Sn/Cu system bonded by diffusion soldering

3. Comment on Cu-In (Copper-Indium)

4. Compound Formation at Cu-In Thin-Film Interfaces Detected by Perturbedγ−γAngular Correlations

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