Dependence of recrystallization on grain morphology of Sn-based solder interconnects under thermomechanical stress
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference13 articles.
1. Orientation imaging studies of Sn-based electronic solder joints
2. Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy
3. Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface
4. Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling Tests
5. Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling
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