Effects of addition participation in the interfacial reaction on the growth patterns of Cu6Sn5-based IMCs during reflow process
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference12 articles.
1. Kinetic theory of flux-driven ripening
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3. Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders
4. Coarsening kinetics of Ni3Sn4 scallops during interfacial reaction between liquid eutectic solders and Cu/Ni/Pd metallization
5. Effect of In Addition on Sn-3.5Ag Solder and Joint with Cu Substrate
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