Microstructural evolution of ɛ-AgZn3 and η-Zn phases in Sn–8.5Zn–0.5Ag–0.01Al–0.1Ga solder during aging treatment
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference27 articles.
1. Sn–Zn low temperature solder
2. The thermal property of lead-free Sn-8.55Zn-1Ag-XAl solder alloys and their wetting interaction with Cu
3. The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn–8.55Zn–0.5Ag–0.1Al–xGa solders and Cu
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2. The Effects of Gallium Additions on the Microstructure of Lead-Free Solder Materials: A Short Review;Solid State Phenomena;2018-08
3. Effects of Al, Pr additions on the wettability and interfacial reaction of Zn–25Sn solder on Cu substrate;Journal of Materials Science: Materials in Electronics;2016-08-10
4. Investigations of the wetting behaviors of Zn–25Sn, Zn–25Sn–XPr and Zn–25Sn–YAl high temperature lead free solders in air and Ar ambient;Journal of Alloys and Compounds;2015-10
5. Interfacial Microstructure Evolution Between Sn-Zn Solders and Ag Substrate During Solid-State Annealing;Journal of Electronic Materials;2014-08-26
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