Interaction behavior between the additives and Sn in Sn–3.0Ag–0.5Cu-based solder alloys and the relevant joint solderability
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference14 articles.
1. Interfacial reactions between lead-free solders and common base materials
2. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
3. Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability
4. Interfacial Reaction between Sn–Ag–Co Solder and Metals
5. Dissolution of stainless steels in molten lead‐free solders
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