Wafer bonding for microsystems technologies-Reference-Cited by-同舟云学术

Wafer bonding for microsystems technologies

Published:1999-04 Issue:1-3 Volume:74 Page:161-168
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Gösele U.,Tong Q.-Y.,Schumacher A.,Kräuter G.,Reiche M.,Plößl A.,Kopperschmidt P.,Lee T.-H.,Kim W.-J.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference57 articles.

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2. Silicon to silicon direct bonding method;Shimbo;J. Appl. Phys.,1986

3. Wafer bonding for silicon-on-insulator technologies;Lasky;Appl. Phys. Lett.,1986

4. K. Petersen, Silicon fusion bonding for pressure sensors, Proc. IEEE Solid State Sensor Conf., 1988, Hilton Head.

5. Diversity and feasibility of direct bonding—a survey of a dedicated optical technology;Haisma;Appl. Opt.,1994

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