Author:
Ernur D,Kondo S,Shamiryan D,Maex K
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference10 articles.
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2. Slurry Chemical Corrosion and Galvanic Corrosion during Copper Chemical Mechanical Polishing
3. Control of Photocorrosion in the Copper Damascene Process
4. Nitric acid-based slurry with citric acid as an inhibitor for copper chemical mechanical polishing
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