Experimental results on the integration of copper and CVD ultra low k material-Reference-Cited by-同舟云学术

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Experimental results on the integration of copper and CVD ultra low k material

Published:2003-11 Issue:2-4 Volume:70 Page:314-319
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Uhlig Matthias,Bertz A.,Erben J.-W.,Schulz S.E.,Gessner T.,Zeidler D.,Wenzel C.,Bartha J.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. M. Uhlig, A. Bertz, H. Brocke, M. Dobler, C. Flannery, G. Jinawali, D. Zeidler, T. Gessner, Proceedings of the Advanced Metallization Conference 2002 (AMC 2002), San Diego, CA, 2002.

2. The International Technology Roadmap for Semiconductors: 2002 Update,2002

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Conductive aluminum line formation on aluminum nitride surface by infrared nanosecond laser;Applied Surface Science;2013-12

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