An inverse heat conduction-convection conjugated problem in estimating the unknown volumetric heat generation of an encapsulated chip
Author:
Funder
Ministry of Science and Technology, Taiwan
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes
Reference26 articles.
1. Application of Inverse Heat Conduction Methods in Temperature Monitoring of Integrated Circuits;Janicki;Sens. Actuators, A Phys.,1998
2. Three-Dimensional Inverse Estimation of Heat Generation in Board Mounted Chips;Huang;J. Thermophys. Heat Transfer.,2001
3. Infrared Identification of Internal Overheating Components Inside an Electric Control Cabinet by Inverse Heat Transfer Problem;Yang;SPIE,2014
4. Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips, ASME;Gonzalez Cuadrado;J. Electron. Packag.,2018
5. An Inverse Problem to Estimate Simultaneously Six Internal Heat Fluxes for A Square Combustion Chamber;Huang;International Journal of Thermal Sciences.,2015
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Research on the thermal properties and interface resistance of multilayer multiscale semiconductor structures;Thermal Science and Engineering Progress;2024-05
2. An inverse problem to estimate simultaneously the heat source strength for multiple integrated circuit chips on a printed circuit board;AIMS Mathematics;2024
3. A variable future-time-steps method for solving nonlinear unsteady inverse heat conduction problems;Thermal Science;2023
4. Research on the Thermal Properties and Interface Resistance of Multilayer, Multiscale Semiconductor Structures;2023
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3