Characterization of a Jet Impingement Heat Sink for Power Electronics Cooling

Author:

Klinkhamer C.,Abishek S.,Iyer K.L.V.,Balachandar R.,Barron R.

Funder

Mitacs

University of Windsor

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes

Reference48 articles.

1. Opportunities, challenges, and potential solutions in the application of fast-switching SiC power devices and converters;Yuan;IEEE Transactions on Power Electronics,2021

2. Comparison of 600V Si, SiC and GaN power devices”;Chowdhury;Materials Science Forum,2014

3. Efficiency characterization and thermal study of GaN based 1 kW inverter;Han,2014

4. V. Jesudhas R. Balachandar R. Barron N. Kar M. Winter G. Schlager K.L.V. Iyer Impinging jet coldplate for power electronics with enhanced heat transfer U. S. Patent W0/2020/102371, (2020).

5. Modelling of jet-impingement cooling for power electronics, EuroSimE 2009–10th International Conference on Thermal;Rizvi,2009

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