Author:
Dragoi Viorel,Lindner Paul F.
Reference14 articles.
1. Contact bonding, including direct bonding in a historical and recent context of materials science and technology, physics and chemistry. Historical review in a broader scope and comparative outlook;Haisma;Mat. Sci. Eng. R,2002
2. Field assisted glass-metal sealing;Wallis;J. Appl. Phys.,1969
3. V. Dragoi, T. Matthias, G. Mittendorfer and P. Lindner, Aligned low temperature wafer bonding for MEMS manufacturing: challenges and promises, Mater. Res. Soc. Symp. Proc. 1052, 2008, 1052-DD03-15, https://doi.org/10.1557/PROC-1052-DD03-15.
4. U. Behringer, B. Weiss, V. Dragoi, J. Brown, R. Scace, W. Baylies et al., SEMI worldwide activities in MEMS standardization, Proc. of Mancef: Commercialization of Micro and Nano Systems, 2004, 304.
5. SEMI MS5-1107: Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test Structures. Available at https://www.semi.org/en/Standards/StandardsPublications