Chemical Mechanical Polishing Method and Practice-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Chemical Mechanical Polishing Method and Practice

Published:2018 Issue: Volume: Page:317-357
ISSN:
Container-title:Handbook of Thin Film Deposition
language:
Short-container-title:

Author:

Cadien Kenneth C.,Nolan Lucy

Publisher

Elsevier

Reference62 articles.

1. The inception of chemical–mechanical polishing for device applications at IBM;Beyer;IBM Micronews,1999

2. Instantaneous fluid film imaging in chemical mechanical planarization;Apone;Mater Res Soc Symp Proc,2005

3. Why CMP?;Li,2008

4. The theory and design of plate glass polishing machines;Preston;J Soc Glass Technol,1927

5. Effect of particle size during tungsten chemical mechanical polishing;Bielmann;Electrochem Solid State Lett,1999

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrochemical Innovations for Sustainable Copper Management in Semiconductor Wastewater;2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2024-05-13

2. Computational investigation of a novel metal thickness measurement system with coaxial triple-coil sensor for chemical mechanical polishing;The International Journal of Advanced Manufacturing Technology;2024-04-29

3. Metal Thickness Measurement System Based on a Double-Coil Eddy-Current Method With Characteristic Ratio Detection;IEEE Transactions on Industrial Electronics;2023-12

4. Back-End (Interconnect) Processing Technologies;Integrated Circuit Fabrication;2023-11-16

5. Etching Technologies and Chemical–Mechanical Polishing;Integrated Circuit Fabrication;2023-11-16

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP