Latest developments in the understanding of PVA brush related issues during post CMP (pCMP) cleaning-Reference-Cited by-同舟云学术

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Latest developments in the understanding of PVA brush related issues during post CMP (pCMP) cleaning

Published:2022 Issue: Volume: Page:591-627
ISSN:
Container-title:Advances in Chemical Mechanical Planarization (CMP)
language:
Short-container-title:

Author:

Yerriboina Nagendra Prasad,Park Jin-Goo

Publisher

Elsevier

Reference52 articles.

1. Chemical mechanical planarization for microelectronics applications;Zantye;Mater. Sci. and Eng.: R: Reports,2004

2. Challenges in chemical mechanical planarization defects of 7 nm device and its improvement opportunities;Yang;2017 China Semicond. Technol. International Conference (CSTIC),2017

3. 17 -- Approaches to defect characterization, mitigation, and reduction;Tseng,2016

4. Post-CMP cleaning,2007

5. Chemical mechanical planarization: slurry chemistry, materials, and mechanisms;Krishnan;Chem. Rev.,2010

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Environmental Impact Assessment of Chemical Mechanical Planarization Consumables: Challenges, Future Needs, and Perspectives;ACS Sustainable Chemistry & Engineering;2024-07-26

2. Nodule contact path of polyvinyl acetal roller brushes on a rotating plate and its relation to cross contamination;Microelectronic Engineering;2023-01

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