Hyperalgesia in a human model of acute inflammatory pain: a methodological study
Author:
Publisher
Ovid Technologies (Wolters Kluwer Health)
Subject
Anesthesiology and Pain Medicine,Neurology (clinical),Neurology
Reference40 articles.
1. Skin reflectance spectrophotometry.;Bjerring;Photodermatology,1987
2. Quantitative sensory examination of epidural anaesthesia and analgesia in man: effects of pre- and post-traumatic morphine on hyperalgesia.;Brennum;Pain,1994
3. Development of secondary hyperalgesia following non-painful thermal stimulation of the skin: a psychophysical study in man.;Cervero;Pain,1993
4. The effect of pre- versus postinjury infiltration with lidocaine on thermal and mechanical hyperalgesia after heat injury to the skin.;Dahl;Pain,1993
5. The relationship of cold and warmth cutaneous sensation to age and gender.;Doeland;Muscle Nerve,1989
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