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Heat transfer of microstructure for integrated circuits

  • Published:1986-01 Issue:1 Volume:13 Page:89-98
  • ISSN:0735-1933
  • Container-title:International Communications in Heat and Mass Transfer
  • language:en
  • Short-container-title:International Communications in Heat and Mass Transfer

Author:

Koh J.C.Y.,Colony R.

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics

Reference5 articles.

1. Heat-Transfer Micreostructures for Integrated Circuits;Tuckerman,1984

2. Optimized Convective Cooling Using Micromachined Structures;Tuckerman;ECS Extended Abstract #125,1982

3. Ultrahigh Thermal Conductance Microstructures for cooling Integrated Circuits;Tuckerman,1981

4. Analysis of Cooling Effectiveness for Porous Material in a Cooant Passage;Koh;Transaction of ASME Journal of Heat Transfer,1974

5. Advances in Heat Transfer, Supplement 1: Laminar flow Forced Convection in Ducts;Shah,1978

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