Audible vibration diagnostics of thermo-elastic residual stress in multi-crystalline silicon wafers
Author:
Publisher
Elsevier BV
Subject
Acoustics and Ultrasonics
Reference9 articles.
1. Residual stress measurement in silicon sheet by Shadow Moire interferometry;Kwon;J Cryst Growth,1987
2. Defect monitoring using scanning photoluminescence spectroscopy in mc-Si wafers;Ostapenko;Semicond Sci Technol,2000
3. Raman micro-spectroscopy study of processing-induced phase transformations and residual stress in silicon;Gogotsi;Semicond Sci Technol,1999
4. Quantitative photoelastic measurement of residual strains in undoped semi-insulating GaAs;Yamada;Appl Phys Lett,1985
5. Physics of thin films;Hoffman,1966
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