Author:
Lin Y.C.,Fang Xiao-Nan,Jiang Yu-Qiang,Jin Hao
Funder
National Natural Science Foundation of China
Subject
Polymers and Plastics,Organic Chemistry
Reference32 articles.
1. Effects of ultrasonic bonding process on polymer-based anisotropic conductive film joints in chip-on-glass assemblies;Lin;Polym. Test.,2011
2. Conductive Adhesives for Electronics Packaging;Liu,1999
3. Electronics Manufacturing: With Lead-free, Halogen-free, and Conductive Adhesive Materials;Lau,2002
4. A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications;Lin;J. Mater. Sci.,2008
5. Electrical characterization of anisotropic conductive adhesive based flip chip for a direct access sensor;Jesudoss;Proc. Electron. Comp. Technol. Conf.,2010
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献