Effects of ultrasonic bonding process on polymer-based anisotropic conductive film joints in chip-on-glass assemblies
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Polymers and Plastics,Organic Chemistry
Reference23 articles.
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3. A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications;Lin;J. Mater. Sci.,2008
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