Design and fabrication of an adhesion force tester for the injection moulding process-Reference-Cited by-同舟云学术

Design and fabrication of an adhesion force tester for the injection moulding process

Published:2013-02 Issue:1 Volume:32 Page:22-31
ISSN:0142-9418
Container-title:Polymer Testing
language:en
Short-container-title:Polymer Testing

Author:

Chen Jian-Yu,Hwang Sheng-Jye

Funder

National Science Council

EverTech Industrial Corporation Limited

Publisher

Elsevier BV

Subject

Polymers and Plastics,Organic Chemistry

Reference10 articles.

1. Design and fabrication of an IC encapsulation mould adhesion force tester;Chang;IEEE Trans. Electron. Packag. Manuf.,2003

2. S.J. Chang, Measurement and Analysis of Adhesion Force on IC Encapsulation Mould, Ph.D Thesis, National Cheng Kung University, Tainan, Taiwan, 2004.

3. Investigation into the release behavior and releasability evaluation of the encapsulation of semiconductor packages;Yoshii;IEEE Trans. Electron. Packag. Manuf.,2007

4. An experimental study on ejection forces of injection moulding;Sasaki;J. Precis. Eng.,2000

5. Application of a chemically adsorbed fluorocarbon film to improve demoulding;Yamamoto;J. Precis. Eng,2009

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