Self-assembled three-dimensional structure of epoxy/polyethersulphone/silver adhesives with electrical conductivity
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,Materials Chemistry,Organic Chemistry
Reference24 articles.
1. Isotropic conductive adhesives filled with low-melting-point alloy fillers
2. Electrical Characteristics of a New Class of Conductive Adhesive
3. Surface Functionalized Silver Nanoparticles for Ultrahigh Conductive Polymer Composites
4. Effects of coupling agents on the properties of epoxy-based electrically conductive adhesives
5. Effect of silane-based coupling agent on the properties of silver nanoparticles filled epoxy composites
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