Fabrication of high-performance copper circuits using laser-induced forward transfer with large receiving gaps based on beam modulation technology-Reference-Cited by-同舟云学术

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Fabrication of high-performance copper circuits using laser-induced forward transfer with large receiving gaps based on beam modulation technology

Published:2023-02 Issue: Volume:87 Page:54-64
ISSN:1526-6125
Container-title:Journal of Manufacturing Processes
language:en
Short-container-title:Journal of Manufacturing Processes

Author:

Huang Ya-jun,Xie Xiao-zhu,Cui Jia-qi,Long Jiang-you

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference33 articles.

1. Laser induced forward transfer (LIFT) of nano-micro patterns for sensor applications;Papazoglou;Microelectron Eng,2017

2. Low-cost fabrication of printed electronics devices through continuous wave laser-induced forward transfer;Sopeña;ACS Appl Mater Interfaces,2017

3. SiC line deposition using laser CVD;Jian;JMaterProcessTechnol,2009

4. Fabrication of robust metallic micropatterns on glass surfaces by selective metallization in laser-induced porous surface structures;Long;Surf Coat Technol,2019

5. Rapid fabrication of conductive copper patterns on glass by femtosecond laser-induced reduction;Cui;Appl Surf Sci,2022

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