Hybrid additive-subtractive manufacturing of high-density copper-based flexible transparent circuits based on side-etch process

Author:

Zhang Houchao,Liu Junjie,Zhu Xiaoyang,Zhang Youchao,Li Hongke,Li Zhenghao,Wang Rui,Zhang Guangming,Lan Hongbo

Funder

Shandong Province Natural Science Foundation

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference38 articles.

1. Large-scale flexible and transparent electronics based on monolayer molybdenum disulfide field-effect transistors;Li;Nat Electron,2020

2. Fabrication of transparent multilayer circuits by inkjet printing;Jiang;Adv Mater,2016

3. Highly transparent and flexible nanopaper transistors;Huang;ACS Nano,2013

4. Recent advances in nanofiber-based flexible transparent electrodes;Zhang;Int J Extrem Manuf,2023

5. Templateless, plating-free fabrication of flexible transparent electrodes with embedded silver mesh by electric-field-driven microscale 3D printing and hybrid hot embossing;Zhu;Adv Mater,2021

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