Microstructure and formation mechanism of Al2O3/Zn5Al/2024Al joint by ultrasonic assisted soldering process
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management
Reference25 articles.
1. Microstructures and mechanical properties of brazed Al2O3/Cu joints with bismuth glass;Chen;Ceram Int,2019
2. Research on joining metal-ceramics composite Al/Al2O3 with cu substrate using solder type Zn–In–Mg;Koleňák;J Compos Mater,2019
3. Review: special brazing and soldering;Li;J Manuf Process,2020
4. Joining of SiO2 ceramic and TC4 alloy by nanoparticles modified brazing filler metal;Bian;Chin J Aeronaut,2020
5. Effect of 2024 Al alloy insert on the grain refinement of a 2024 Al alloy prepared via insert Mold casting;Zhu;Metals,2019
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1. A novel packaging method for FBG temperature sensors based on ultrasonic-assisted soldering technology;Sensors and Actuators A: Physical;2024-08
2. Microstructure, joining mechanism, mechanical properties and optimization of inactive solder (Sn9Zn) in low temperature ultrasonic soldering of AlN ceramics and 2024Al;Ceramics International;2024-08
3. Inhibition of intermetallic compounds using pure Ni or Ni–Al2O3 nanocomposite coating during the ultrasonic-assisted soldering of Mg/Al dissimilar metals;Journal of Materials Processing Technology;2024-07
4. Corrigendum to “Microstructure and formation mechanism of Al2O3/Zn5Al/2024Al joint by ultrasonic assisted soldering process” [J Manuf Process 83 (2022) 313–324];Journal of Manufacturing Processes;2024-06
5. Analysis of wall thickness variation of copper tube electrode processed by ultrasonic vibration;The International Journal of Advanced Manufacturing Technology;2024-03-11
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