Ultrathin diamond blades for dicing single crystal SiC developed using a novel bonding method-Reference-Cited by-同舟云学术

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Ultrathin diamond blades for dicing single crystal SiC developed using a novel bonding method

Published:2022-12 Issue: Volume:84 Page:88-99
ISSN:1526-6125
Container-title:Journal of Manufacturing Processes
language:en
Short-container-title:Journal of Manufacturing Processes

Author:

Li Mian,Mu Dekui,Huang Shuiquan,Wu Yueqin,Meng Hui,Xu Xipeng,Huang Han

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference39 articles.

1. Optimizing the wafer dicing process;Efrat,1993

2. Abrasive processes for micro parts and structures;Aurich;CIRP Ann,2019

3. SiC MEMS: opportunities and challenges for applications in harsh environments;Mehregany;Thin Solid Films,1999

4. Introduction to light emitting diode technology and applications;Held,2016

5. Deformation and removal of semiconductor and laser single crystals at extremely small scales;Wu;Int J Extrem Manuf,2020

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4. The influence of cracks in the coupling region of micro-grinding and laser stealth combined dicing on the quality of cutting side walls;Journal of Manufacturing Processes;2024-06

5. Influence of diamond abrasives on material removal of single crystal SiC in mechanical dicing;Journal of Materials Processing Technology;2024-06

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