High-precision servo control design and optimization for dicing semiconductor wafer-Reference-Cited by-同舟云学术

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High-precision servo control design and optimization for dicing semiconductor wafer

Published:2024-05 Issue: Volume:117 Page:346-354
ISSN:1526-6125
Container-title:Journal of Manufacturing Processes
language:en
Short-container-title:Journal of Manufacturing Processes

Author:

Chen Fengjun,Huang Jianhang,Xu Jialiang

Funder

Science and Technology Plan Project of Wenzhou Municipality

National Natural Science Foundation of China

Natural Science Foundation of Zhejiang Province

Publisher

Elsevier BV

Reference33 articles.

1. 2D semiconductor based flexible photoresponsive ring oscillators for artificial vision pixels;Li;ACS Nano,2023

2. Recent progress in MXene and graphene-based nanocomposites for microwave absorption and EMI shielding;Chand;Arab. J. Chem.,2022

3. Nanoindentation induced anisotropy of deformation and damage behaviors of MgF2 crystals;Piao;J Mater Res Technol,2024

4. Study of short-wavelength red semiconductor laser using high Ga composition GaInP quantum well based on Ge/SiGe substrate;Xie;Appl. Phys. B Lasers Opt.,2023

5. Processing and characterisation of epoxy–SiC functionally graded polymer matrix composites;Amuthan;J. Inorg. Organomet. Polym.,2022

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The influence of cracks in the coupling region of micro-grinding and laser stealth combined dicing on the quality of cutting side walls;Journal of Manufacturing Processes;2024-06

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