Leakage characterization of top select transistor for program disturbance optimization in 3D NAND flash

Author:

Zhang YuORCID,Jin Lei,Jiang Dandan,Zou Xingqi,Zhao Zhiguo,Gao Jing,Zeng Ming,Zhou Wenbin,Tang Zhaoyun,Huo Zongliang

Funder

National Natural Science Foundation of China

Key project of Sichuan provincial Education Department

Publisher

Elsevier BV

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. Effects of floating-gate interference on NAND flash memory cell operation;Lee;IEEE Electron Device Lett,2002

2. New scaling limitation of the floating gate cell in NAND flash memory;Kim;IRPS,2010

3. A highly scalable 8-layer 3D vertical-gate (VG) TFT NAND flash using junction-free buried channel BE-SONOS device;Lue;VLSI Technol,2010

4. Pipe-shaped BiCS flash memory with 16 stacked layers and multi-level-cell operation for ultra high density storage devices;Katsumata;VLSI Technol,2009

5. Vertical cell array using TCAT (Terabit Cell Array Transistor) technology for ultra high density NAND flash memory;Jang;VLSI Technol,2009

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1. SiGe/Si Heterojunction Drain Transistor for Faster 3D NAND Flash Memory Erase;2024 IEEE International Memory Workshop (IMW);2024-05-12

2. Bidirectional Precharge and Negative Bias Scheme for Program Disturbance Suppression in 3-D NAND Flash Memory;IEEE Transactions on Electron Devices;2023-12

3. A Review of Program disturb of 3D NAND Flash Memory;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

4. A Review of Cell Operation Algorithm for 3D NAND Flash Memory;Applied Sciences;2022-10-22

5. A Novel Program Suspend Scheme for Improving the Reliability of 3D NAND Flash Memory;IEEE Journal of the Electron Devices Society;2022

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