Analytical models for shock isolation of typical components in portable electronics-Reference-Cited by-同舟云学术

Analytical models for shock isolation of typical components in portable electronics

Published:2009-12 Issue:12 Volume:36 Page:1377-1384
ISSN:0734-743X
Container-title:International Journal of Impact Engineering
language:en
Short-container-title:International Journal of Impact Engineering

Author:

Zhou C.Y.,Yu T.X.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Ocean Engineering,Safety, Risk, Reliability and Quality,Aerospace Engineering,Automotive Engineering,Civil and Structural Engineering

Reference20 articles.

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4. Mechanical shock test method;JESD22-B104-B,2001

5. Subassembly mechanical shock test method;JESD22-B110,2001

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