A new wide-dimensional freestanding microstructure fabrication technology using laterally formed porous silicon as a sacrificial layer-Reference-Cited by-同舟云学术

A new wide-dimensional freestanding microstructure fabrication technology using laterally formed porous silicon as a sacrificial layer

Published:2000-08 Issue:1-2 Volume:84 Page:181-185
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Lee Choon-Sup,Lee Jae-Duk,Han Chul-Hi

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference22 articles.

1. Anisotropic etching of silicon with KOH–H2O–Isopropyl Alcohol;Price;Electrochem. Soc. Proc,1973

2. Fabrication of novel three-dimensional microstructures by the anisotropic etching of (100) and (110) silicon;Bassous;IEEE Trans. Electron. Devices,1979

3. Copper precipitation on dislocations in silicon;Dash;J. Appl. Phys,1956

4. Surface micromachining for microelectromechanical systems;Bustillo;Proc. IEEE,1998

5. Micromachining applications of porous silicon;Steiner;Thin Solid Films,1995

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