Hermetic wafer bonding based on rapid thermal processing-Reference-Cited by-同舟云学术

Hermetic wafer bonding based on rapid thermal processing

Published:2001-07 Issue:3 Volume:91 Page:398-402
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Chiao Mu,Lin Liwei

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference11 articles.

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