Subject
Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation
Reference7 articles.
1. D.L. Deborah, Chung Materials for Electronic Packaging, Butterworths, London, pp. 30–31, 145–171.
2. Rao R. Tummala, Eugene J. Rymaszewski, Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York, 1988, pp. 395–396.
3. J.C. Hsiung, R.A. Pearson, Processing diagrams for polymeric die attach adhesives, Electron. Comp. Technol. Conf. (1997) 636.
4. T. Hongsmatip, B. Twombly, Dynamic mechanical analysis of silver/glass die attach material, Electron. Comp. Technol. Conf. (1995) 692.
5. J. Rosenfeld, S. Rojstaczer, M. Xu, P. McCollum, A new non-epoxy liquid die attach adhesive, Electron. Comp. Technol. Conf. (1998) 1402.
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