Background of the titanium nitride deposition-Reference-Cited by-同舟云学术

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Background of the titanium nitride deposition

Published:1998-07 Issue:3-4 Volume:50 Page:273-276
ISSN:0042-207X
Container-title:Vacuum
language:en
Short-container-title:Vacuum

Author:

Szikora B

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation

Reference10 articles.

1. Bunshah, R. F., Handbook of Deposition of Technologies for Films and Coatings, Noyes Publications, New Jersey, 1991.

2. Rossnagel, S. M., Cuomo, J. J. and Westwood, W. D., Handbook of Plasma Processing Technology, Noyes Publications, New Jersey, 1990.

3. Yee, K. K., Proc. Conf. Chem. Vap. Deposition, 5th Int. Conf., 1975, 238.

4. Thornton, J. A., J. Vac. Sci. Technol., 1978, 15(2), 188.

5. Clements, R. M., J. Vac. Sci. Technol., 1978, 15(2), 193.

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electronically conductive porous TiN ceramics with enhanced strength by aqueous gel‐casting;Journal of the American Ceramic Society;2018-08-16

2. Bulk titanium nitride ceramics – Significant enhancement of hardness by silicon nitride addition, nanostructuring and high pressure sintering;Journal of the European Ceramic Society;2015-09

3. Study on structural, morphological and electrical properties of sputtered titanium nitride films under different argon gas flow;Materials Chemistry and Physics;2012-06

4. Reactive sputter deposition of TiNxfilms, simulated with a particle-in-cell/Monte Carlo collisions model;New Journal of Physics;2009-02-25

5. Study on the influence of nitrogen on titanium nitride in a dc post magnetron sputtering plasma system;Journal of Physics D: Applied Physics;2008-09-05

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