Assembly technology of electronic components for e-textiles-Reference-Cited by-同舟云学术

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Assembly technology of electronic components for e-textiles

Published:2024-04 Issue: Volume:7 Page:100056
ISSN:2772-3704
Container-title:Power Electronic Devices and Components
language:en
Short-container-title:Power Electronic Devices and Components

Author:

Blecha Tomas^ORCID,Hirman Martin,Navratil Jiri

Funder

Západočeská Univerzita v Plzni

Technology Agency of the Czech Republic

Publisher

Elsevier BV

Reference13 articles.

1. Alternative technology for SMD components connection by non-conductive adhesive on a flexible substrate;Hirman;Journal of Materials Science: Materials in Electronics,2019

2. A historical review of the development of electronic textiles;Hughes-Riley;Fibers,2018

3. Towards embroidered circuit board from conductive yarns for E-textiles;Ismar;IEEE Access : Practical Innovations, Open Solutions,2020

4. Contacting of SMD components on the textile substrates;Kalas,2020

5. Laundering reliability of electrically conductive fabrics for E-textile applications;Lee,2019

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Deployment of 3D vision systems integrated with robots in traceability systems to achieve dynamic positioning in fully automated lines;Advances in 3OM: Opto-Mechatronics, Opto-Mechanics, and Optical Metrology (3OM 2023);2024-06-12

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