A wood-inspired epoxy-based electronic packaging material with vertically aligned thermally conductive channels for electromagnetic waves absorption and thermal management
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Published:2024-09
Issue:
Volume:495
Page:153202
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ISSN:1385-8947
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Container-title:Chemical Engineering Journal
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language:en
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Short-container-title:Chemical Engineering Journal
Author:
Luo Jiawei,
Lv Ze,
Wang Qianqian,
Zhang Linping,
Zhong Yi,
Xu Hong,
Mao ZhipingORCID