Micro milling of sintered tungsten–copper composite materials

Author:

Uhlmann Eckart,Piltz Sascha,Schauer Kai

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference9 articles.

1. E. Uhlmann, S. Piltz, U. Doll, Fabrication of micro channels in extensive forming tools by micro electrical discharge grinding (μ-EDG), 5th International Conference on Progress of Machine Technology, Beijing, 2000.

2. Brush Wellman advances Cu/W technology;Sepulveda,1998

3. Processing of tungsten- and molybdenum-copper housings for microelectronic packaging via metal injection moulding (MIM);Kneuwer,2000

4. Simulation and fracture prediction for sintered materials in upsetting by FEM;Zhang;J. Mater. Process. Technol.,2000

5. The Manufacturing Near Net Shape of Cu–W Composite Materials;Okabe,1985

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